Cable | Copper layers [μm] | Polyimide layers [μm] | Coverlay | Surface finish | 238U [pg/g] | 232Th [pg/g] | natK [ng/g] |
---|---|---|---|---|---|---|---|
nEXO SiPM | 18 (x2) | 50.8 (x1) | No | No | 20 ± 2 | <12.3 | 40 ± 12 |
nEXO SiPM [Com.] | 18 (x2) | 50.8 (x1) | No | No | 1300-6200 | 16-63 | |
DAMIC-M CCD | 18 (x2) | 50.8 (x1) | x2 | ENIG | 31 ± 2 | 13 ± 3 | 550 ± 20 |
DAMIC-M CCD [Com.] | 18 (x2) | 50.8 (x1) | x2 | ENIG | 2600 ± 40 | 261 ± 12 | 170 ± 50 |
18 (x1) | 25.4 (x1) | No | No | 412 ± 47 | <117 | ||
18 (x4) | 25/125 (x3/x4) | No | No | 650 ± 490 | 3700 ± 2500 | 2100 ± 840 | |
DAMIC at SNOLAB [4] | 18 (x5) | 25.4 (x4) | x2 | ENIG | 4700 ± 400 | 790 ± 120 | 940 ± 60 |